Senior Manufacturing Engineer, Tech Lead

Job Description

Job Description

At WHOOP, we're on a mission to unlock human performance and healthspan. WHOOP empowers users to perform at a higher level through a deeper understanding of their bodies and daily lives.

As a Senior Manufacturing Engineer, Tech Lead you will own manufacturing technical readiness for two concurrent NPI programs, serving as the lead engineer on one program while building a small dedicated team (a Junior Manufacturing Engineer and an in-region Process Engineer) to execute the second. You will develop and troubleshoot processes, support manufacturing ramps, and ensure high quality and efficiency from prototype builds through production; partnering closely with Mechanical, Electrical, Supply Chain, Quality, and factory teams.

You are experienced in DFX, process design and validation, fixture and equipment design, and thrive being hands-on at the factory. Reporting to the Director of Manufacturing Engineering, you will be responsible and accountable for timely execution of NPI deliverables to program deadlines, while coaching and developing your team to deliver consistent, scalable manufacturing results.

• Own and lead end-to-end manufacturing execution for NPI, ensuring deliverables, risks, and milestones are met on schedule; accountable for on-time readiness to program deadlines
• Lead a small dedicated manufacturing engineering team, including mentoring a Junior Manufacturing Engineer and directing an in-region (Asia) Process Engineer to deliver parallel workstreams across two programs
• Drive manufacturing technical readiness across builds: process development, documentation, optimization, validation, and handoff to sustaining/operations
• Provide technical leadership and prioritization across two projects, balancing hands-on execution with delegation, coaching, and daily coordination to maintain velocity and quality
• Tactically manage factory teams and partners on design and qualification of fixtures and equipment; apply data-driven methodologies to determine how to leverage automation for as many processes as possible versus manual assembly
• Execute DFX and apply Lean Six Sigma methodologies throughout development and production; influence design decisions to improve yield, reliability, manufacturability, scaleability, and cost
• Ensure processes meet product specification requirements and are verified via robust process control and qualification plans
• Define and conduct DOEs, FA, and structured problem solving (DMAIC, 8D, etc.) to prevent or resolve manufacturing challenges, identify root cause, and implement corrective/preventive actions
• Drive cross-functional work on rapid development cycles while continuously evaluating options for optimal form, fit, and function
• Provide clear program-level communication: project status, risk/issue tracking, build readiness, and escalation aligned to leadership expectations
• Coordinate parallel path/contingency efforts for high-risk milestones and supplier readiness gaps
• Partner closely with CM/JDM and internal stakeholders to align schedule, capacity, test coverage, and quality targets
• Willingness to travel up to 25% of the time internationally

• Degree in Engineering, Manufacturing, or a related technical field
• 7+ years of manufacturing experience with moderate to high volume consumer electronics (technical lead experience strongly preferred)
• Experience with ultrasonic welding, adhesives, heat staking, and assembly of small battery-powered electronics utilizing both automated and manual processes
• Demonstrated understanding of injection molded plastic part principles, defect modes, and process qualification
• Understanding of GD&T principles to define and evaluate process quality
• Proven track record qualifying manufacturing processes and troubleshooting issues on the factory floor
• Proficiency in SolidWorks with best practices for fixture design
• Impeccable organizational, multi-tasking, and time management skills, with demonstrated ability to manage competing priorities across multiple programs
• Experience effectively communicating with engineering, manufacturing, and external partners and contractors in a CM/JDM model
• Demonstrated ability to mentor engineers, lead cross-functional teams, and drive accountability across distributed partners

This role is based in the WHOOP office located in Boston, MA. The successful candidate must be prepared to relocate if necessary to work out of the Boston, MA office.

Interested in the role, but don’t meet every qualification? We encourage you to still apply! At WHOOP, we believe there is much more to a candidate than what is written on paper, and we value character as much as experience. As we continue to build a diverse and inclusive environment, we encourage anyone who is interested in this role to apply.

WHOOP is an Equal Opportunity Employer and participates in E-verify to determine employment eligibility. It is unlawful in Massachusetts to require or administer a lie detector test as a condition of employment or continued employment. An employer who violates this law shall be subject to criminal penalties and civil liability.

The WHOOP compensation philosophy is designed to attract, motivate, and retain exceptional talent by offering competitive base salaries, meaningful equity, and consistent pay practices that reflect our mission and core values.

At WHOOP, we view total compensation as the combination of base salary, equity, and benefits, with equity serving as a key differentiator that aligns our employees with the long-term success of the company and allows every member of our corporate team to own part of WHOOP and share in the company’s long-term growth and success.

The U.S. base salary range for this full-time position is $150,000-$195,000 Salary ranges are determined by role, level, and location. Within each range, individual pay is based on factors such as job-related skills, experience, performance, and relevant education or training.

In addition to the base salary, the successful candidate will also receive benefits and a generous equity package.

These ranges may be modified in the future to reflect evolving market conditions and organizational needs. While most offers will typically fall toward the starting point of the range, total compensation will depend on the candidate’s specific qualifications, expertise, and alignment with the role’s requirements.

Learn more about WHOOP .